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TMS320F28335PGFA Texas Instruments National Semiconductor

Product Details

Place of Origin: USA

Brand Name: TEXAS INSTRUMENTS

Model Number: TMS320F28335PGFA

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: Communicable

Packaging Details: STANDRAD

Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability: 10000PCS PER WEEK

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TMS320F28335PGFA Texas Instruments National Semiconductor

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Texas Instruments National Semiconductor TQFP-64

Product Category:
TEXAS INSTRUMENTS
Series:
TMS320F28335PGFA
Mounting Style:
SMD/SMT
Package / Case:
TQFP-64
Data RAM Size:
1 KB
Supply Voltage - Min:
1.8 V
Supply Voltage - Max:
5.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 85 C
Packaging:
MouseReel
Brand:
TEXAS INSTRUMENTS/national
Data RAM Type:
SRAM
Product Category:
TEXAS INSTRUMENTS
Series:
TMS320F28335PGFA
Mounting Style:
SMD/SMT
Package / Case:
TQFP-64
Data RAM Size:
1 KB
Supply Voltage - Min:
1.8 V
Supply Voltage - Max:
5.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 85 C
Packaging:
MouseReel
Brand:
TEXAS INSTRUMENTS/national
Data RAM Type:
SRAM
TMS320F28335PGFA Texas Instruments National Semiconductor
TEXAS INSTRUMENTS/National TMS320F28335PGFA IC Chips Integrated Circuit
 

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.

 

 

Texas Instruments
Product Category: Digital Signal Processors & Controllers - DSP, DSC
RoHS: Details
DSCs
TMS320F28335
Delfino
SMD/SMT
LQFP-176
C28x
1 Core
150 MHz
-
-
512 kB
68 kB
1.9 V
- 40 C
+ 125 C
Tray
ADC Resolution: 12 bit
Brand: Texas Instruments
Data Bus Width: 32 bit
Height: 1.4 mm
Instruction Type: Floating Point
Interface Type: CAN/I2C/SCI/SPI/UART
Length: 24 mm
Moisture Sensitive: Yes
Number of I/Os: 88 I/O
Number of Timers/Counters: 3 Timer
Product Type: DSP - Digital Signal Processors & Controllers
Program Memory Type: Flash
40
Subcategory: Embedded Processors & Controllers
Supply Voltage - Min: 1.805 V, 3.135 V
Width: 24 mm
Part # Aliases: PLCF28335PGFA
Unit Weight: 0.066886 oz
Texas Instruments TMS320F28335PGFA Enlarged Image
 
 
TMS320F28335PGFA Texas Instruments National Semiconductor 1TMS320F28335PGFA Texas Instruments National Semiconductor 2

TMS320F28335PGFA Texas Instruments National Semiconductor 3

TMS320F28335PGFA Texas Instruments National Semiconductor 4

TMS320F28335PGFA Texas Instruments National Semiconductor 5

TMS320F28335PGFA Texas Instruments National Semiconductor 6

TMS320F28335PGFA Texas Instruments National Semiconductor 7

Quality information

RatingCatalog
RoHSYes
REACHYes
Lead finish / Ball materialNIPDAU
MSL rating / Peak reflowLevel-3-260C-168 HR
Quality, reliability
& packaging information
View or download

Export classification

*For reference only

  • US ECCN: 3A991A2

Packaging information

Package | PinsLQFP (PGF) | 176
Operating temperature range (°C)-40 to 85
Package qty | Carrier40 | JEDEC TRAY (5+1)

Features for the TMS320F28335

  • High-performance static CMOS technology
    • Up to 150 MHz (6.67-ns cycle time)
    • 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x)
    • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • More than 2M × 16 address reach
  • On-chip memory
    • F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
    • F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
    • F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K × 16)
    • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock
    • Protects flash/OTP/RAM blocks
    • Prevents firmware reverse-engineering
  • Enhanced control peripherals
    • Up to 18 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to 6 event capture inputs
    • Up to 2 Quadrature Encoder interfaces
    • Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
    • Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals
    • Up to 2 CAN modules
    • Up to 3 SCI (UART) modules
    • Up to 2 McBSP modules (configurable as SPI)
    • One SPI module
    • One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 80-ns conversion rate
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced debug features
    • Analysis and breakpoint functions
    • Real-time debug using hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™ and SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options:
    • Lead-free, green packaging
    • 176-ball plastic Ball Grid Array (BGA) [ZJZ]
    • 179-ball MicroStar BGA™ [ZHH]
    • 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
    • 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]
    • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]
  • Temperature options:
    • A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
    • S: –40°C to 125°C (PTP, ZJZ)
    • Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

 

FAQ

Q1:About the quotation of IC BOM?
A1:The company has the procurement channels of original integrated circuit manufacturers at home and abroad and a professional product solution analysis team to select high-quality, low-cost electronic components for customers.
Q2:Quotation for PCB and PCBA solutions?
A2: The company's professional team will analyze the application range of the PCB and PCBA solutions provided by the customer and the parameter requirements of each electronic component, and ultimately provide customers with high-quality and low-cost quotation solutions.
Q3:About chip design to finished product?
A3: We have a complete set of wafer design, wafer production, wafer testing, IC packaging and integration,and IC product inspection services.
Q4:Does our company have a minimum order quantity (MOQ) requirement?
A4: No, we do not have MOQ requirement, we can support your projects starting from prototypes to mass productions.
Q5:How to ensure that customer information is not leaked?
A5: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
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