Quality information
RatingCatalog |
RoHSYes |
REACHYes |
Lead finish / Ball materialNIPDAU |
MSL rating / Peak reflowLevel-3-260C-168 HR |
Quality, reliability & packaging information |
Export classification
*For reference only
- US ECCN: 3A991A2
More TMS320F28335 information
Packaging information
Package | PinsLQFP (PGF) | 176 |
Operating temperature range (°C)-40 to 85 |
Package qty | Carrier40 | JEDEC TRAY (5+1) |
Features for the TMS320F28335
- High-performance static CMOS technology
- Up to 150 MHz (6.67-ns cycle time)
- 1.9-V/1.8-V core, 3.3-V I/O design
- High-performance 32-bit CPU (TMS320C28x)
- IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
- 16 × 16 and 32 × 32 MAC operations
- 16 × 16 dual MAC
- Harvard bus architecture
- Fast interrupt response and processing
- Unified memory programming model
- Code-efficient (in C/C++ and Assembly)
- Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
- 16-bit or 32-bit External Interface (XINTF)
- More than 2M × 16 address reach
- On-chip memory
- F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
- F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
- F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
- 1K × 16 OTP ROM
- Boot ROM (8K × 16)
- With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
- Standard math tables
- Clock and system control
- On-chip oscillator
- Watchdog timer module
- GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
- Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
- 128-bit security key/lock
- Protects flash/OTP/RAM blocks
- Prevents firmware reverse-engineering
- Enhanced control peripherals
- Up to 18 PWM outputs
- Up to 6 HRPWM outputs with 150-ps MEP resolution
- Up to 6 event capture inputs
- Up to 2 Quadrature Encoder interfaces
- Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
- Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
- Three 32-bit CPU timers
- Serial port peripherals
- Up to 2 CAN modules
- Up to 3 SCI (UART) modules
- Up to 2 McBSP modules (configurable as SPI)
- One SPI module
- One Inter-Integrated Circuit (I2C) bus
- 12-bit ADC, 16 channels
- 80-ns conversion rate
- 2 × 8 channel input multiplexer
- Two sample-and-hold
- Single/simultaneous conversions
- Internal or external reference
- Up to 88 individually programmable, multiplexed GPIO pins with input filtering
- JTAG boundary scan support
- IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
- Advanced debug features
- Analysis and breakpoint functions
- Real-time debug using hardware
- Development support includes
- ANSI C/C++ compiler/assembler/linker
- Code Composer Studio™ IDE
- DSP/BIOS™ and SYS/BIOS
- Digital motor control and digital power software libraries
- Low-power modes and power savings
- IDLE, STANDBY, HALT modes supported
- Disable individual peripheral clocks
- Endianness: Little endian
- Package options:
- Lead-free, green packaging
- 176-ball plastic Ball Grid Array (BGA) [ZJZ]
- 179-ball MicroStar BGA™ [ZHH]
- 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
- 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]
- 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]
- Temperature options:
- A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
- S: –40°C to 125°C (PTP, ZJZ)
- Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)